DRC錯誤代碼代碼相關(guān)對象說明單一字符代碼LLine走線PPin元件腳VVia貫穿孔KKeep in/out允許區(qū)域/禁止區(qū)域CComponent元件層級EElectrical Constraint電氣約束JT-Junction呈現(xiàn)T形的走線IIsland Form被Pin或Via圍成的負片孤銅錯誤代碼前置碼說明WWire與走線相關(guān)的錯誤DDesign與整個相關(guān)的錯誤MSoldemask與防焊層相關(guān)的錯誤錯誤代碼后置碼說明SShape/Stub與走線層的Shape或分支相關(guān)的錯誤NNotAllowed與不允許的設(shè)置相關(guān)的錯誤WWidth與寬度相關(guān)的錯誤雙字符錯誤代碼BBBondpad to BondpadBondpad之間的錯誤BLBondpad to LineBondpad與Line之間的錯誤BSBondpad to ShapeBondpad與Shape之間的錯誤CCPackage to PackagePackage之間的Spacing錯誤Symbol Soldermask to SymbolSoldermask零件防焊層之間的Spacing錯誤DFDifferential Pair Length Tolerance差分對走線的長度誤差過長Differential Pair Primary Max Separation差分對走線的主要距離太大Differential Pair Secondary Max Separation差分對走線的次要距離太大Differential Pair Secondary Max Length差分對走線的次要距離長度過長DIDesignConstraint Negative Plane Island負片孤銅的錯誤EDPropagation-Delay走線的長度錯誤Relative-Propagation-Delay走線的等長錯誤ELMax Exposed Length走線在外層（TOP&BOTTOM）的長度過長EPMax Net Parallelism Length-Distance Pair已超過Net之間的平行長度ESMax Stub Length走線的分支過長ETElectrical Topology走線連接方式的錯誤EVMax Via Count已超過走線使用的VIA的最大數(shù)目EXMax Crosstalk已超過Crosstalk值MaxPeakCrosstalk已超過Peak Crosstalk值HHHold to Hold Spacing鉆孔之間的距離太近HWDiagonal Wire to Hold Spacing斜線與鉆孔之間的距離太近Hold to Orthogonal Wire Spacing鉆孔與垂直/水平線之間的距離太近IMImpedance Constraint走線的阻抗值錯誤JNT Junction Not Allowed走線呈T形的錯誤KBRoute Keepinto BondpadBondpad在Keepin之外Route keepoutto BondpadBondpad在keepout之內(nèi)Via KeepouttoBondpadBondpad在Via Keepout之內(nèi)KCPackage to Place Keepin Spacing元件在Place Keepin之外Package to Place Keepout Spacing元件在Place Keepout之內(nèi)KLLine to Route Keepin Spacing走線在Route Keepin之外Line to Route Keepout Spacing走線在Route Keepout之內(nèi)KSShape to Route Keepin SpacingShape在Route Keepin之外Shape to Route Keepout SpacingShape在Route Keepout之內(nèi)KVBBVia to Route Keepin SpacingBBVia在Route Keepin之外BBVia to Route Keepout SpacingBBVia在Route Keepout之內(nèi)BBVia to Via Keepout SpacingBBVia在Via Keepout之內(nèi)Test Via to Route Keepin SpacingTest Via在Route Keepin之外Test Via to Route Keepout SpacingTest Via在Route Keepout之內(nèi)Test Via to Via Keepout SpacingTest Via在Via Keepout之內(nèi)Through Via to Route Keepin SpacingThrough Via在Route Keepin之外Through Via to Route Keepout SpacingThrough Via在Route Keepout之內(nèi)Through Via to Via Keepout SpacingThrough Via在Via Keepout之內(nèi)LBMin Self Crossing Loopback Length無LLLine to Line Spacing走線之間太近LSLine to Shape Spacing走線與Shape太近LWMin Line Width走線的寬度太細Min Neck Width走線變細的寬度太細MASoldermask Alignment Error PadSoldermask Tolerance太小MCPin/Via Soldermask to Symbol SoldermaskPad與Symbol Soldermask之間的錯誤MMPin/Via Soldermask to Pin/Via SoldermaskPadSoldermask之間的錯誤PBPin to BondpadPin與Bondpad之間的錯誤PLLine to SMD Pin Spacing走線與SMD元件腳太近Line to Test Pin Spacing走線與Test元件腳太近Line to Through Pin Spacing走線與Through元件腳太近PPSMD Pin to SMD Pin SpacingSMD元件腳與SMD元件腳太近SMD Pin to Test Pin SpacingSMD元件腳與Test元件腳太近Test Pin to Test Pin SpacingTest元件腳與Test元件腳太近Test Pin to Through Pin SpacingTest元件腳與Through元件腳太近Through Pin to SMD Pin SpacingThrough元件腳與SMD元件腳太近Through Pin to Through Pin SpacingThrough元件腳與Through元件腳太近PSShape to SMD Pin SpacingShape與SMD元件腳太近Shape to Test Pin SpacingShape與Test元件腳太近Through Pin to Shape SpacingThrough元件腳與Shape太近PVBBVia to SMD Pin SpacingBBVia與SMD元件腳太近BBVia to Test Pin SpacingBBVia與Test元件腳太近BBVia to Through Pin SpacingBBVia與Through元件腳太近SMD Pin to Test Via SpacingSMD Pin與Test Via太近SMD Pin to Through Via SpacingSMD Pin與Through Via太近Test Pin to Test Via SpacingTest Pin與Test Via太近Test Pin to Through Via SpacingTest Pin與Through Via太近Test Via to Through Pin SpacingTest Via與Through Pin太近Through Pin to Through Via SpacingThrough Pin與Through Via太近RCPackage to Hard Room元件在其他的Room之內(nèi)REMin Length RouteEnd Segment at 135Degree無Min Length RouteEnd Segment at 45/90Degree無SB135Degree Turn to Adjacent Crossing Distance無90Degree Turn to Adjacent Crossing Distance無SLMin Length Wire Segment無Min Length Single Segment Wire無SNAllow on Etch Subclass允許在走線層上SOSegment Orientaion無BBBondpad to BondpadBondpad之間的錯誤SSShape to ShapeShape之間的錯誤TAMax Turn Angle無VBVia to BondpadVia與Bondpad之間的錯誤VGMax BB Via Stagger Distance同一段線的BB Via之間的距離太長Min BB Via GapBB Via之間太近Min BB Via Stagger Distance同一段線的BB Via之間的距離太近Pad/Pad Direct ConnectPad在另一個Pad之上VLBB Via to Line SpacingBB Via與走線太近Line to Through Via Spacing走線與Through Via太近Line to Test Via Spacing走線與Test Via太近VSBB Via to Shape SpacingBB Via與Shape太近Shape to Test Via SpacingShape與Test Via太近Shape to Through Via SpacingShape與Through Via太近VVBB Via to BB ViaSpacingBB Via之間太近BB Via to Test Via SpacingBB Via與Test Via太近BB Via to Through Via SpacingBB Via與Through Via太近Test Via to Test Via SpacingTest Via之間太近Test Via to Through Via SpacingTest Via與Through Via太近Through Via to Through Via SpacingThrough Via之間太近WAMin Bonding Wire LengthBonding Wire長度太短WEMin End Segment Length無Min Length Wire End Segment at 135Degree無Min Length Wire End Segment at 45/90Degree無WIMax Bonding Wire LengthBonding Wire長度太長WWDiagonal Wire to Diagonal Wire Spacing斜線之間太近Diagonal Wire to Orthogonal Wire Spacing斜線與垂直/水平線之間的距離太近Orthogonal Wire to Orthogonal Wire Spacing垂直/水平線之間的距離太近WXMax Number of Crossing無Min Distance between Crossing無XB135 Degree Turn to Adjacent Crossing Distance無90 Degree Turn to Adjacent Crossing Distance無XDExternally Determined Violation無XSCrossing to Adjacent Segment Distances無