英飛凌(Infineon)公司的XMMTM6080是完整的HSDPA平臺,它包括了所有的硬件(基帶,功率管理和收發(fā)器)以及3GGP兼容的Release 5雙模式協(xié)議堆棧.高度集成的雙模式HSDPA/WCDMA/E-GPRS調(diào)制解調(diào)器,以及高速多媒體硬件加速器和先進的連接性能,使得XMMTM6080完全滿足當今手機的需求,HSDPA的速率達到7.2Mbps.本文介紹了XMMTM6080 HSDPA平臺的主要特性,調(diào)制解調(diào)器的主要特性以及優(yōu)勢, X-GOLDTM608方框圖以及XMMTM6080平臺的方框圖.

X-GOLDTM608/XMMTM6080
X-GOLDTM608 - the Heart of Infineon’s 7.2Mbit/s HSDPA Platform XMMTM6080
W I T H T H E X M M T M6 0 8 0 Infineon offers the world’s smallest HSDPA
7.2Mbit/s HSDPA solution to the mobile phone industry. The XMMT M 6080 is
a complete platform offering including all HW components (baseband, power
management, transceiver) and an in-house 3GGP compliant Release 5 dual mode
protocol stack. The highly integrated dual-mode HSDPA/WCDMA/E-GPRS modem,
together with high speed multimedia hardware accelerators and the advanced
connectivity options enable the XMMT M 6080 to fulfil the requirements of tomorrow’s
mobile phones.
Infineon is one of the early platform vendors to support HSDPA category 8
(7.2 Mbit/s). The implementation of equalizer based advanced receiver technology
improves the data throughput, especially at high data rates, by up to 40%.
The HSDPA performance of X-GOLDTM608 meets and exceeds all test cases as
specified in the 3GPP standard.
Infineon’s 3.5 G physical layer architecture is future-proof and designed for an easy
upgrade to higher HSDPA data rates, HSUPA and also Rx-diversity.



XMMTM6080主要的應用特性:

ARM 926 based modem and application processor
Hardware security - DRM 2.0, E-fuse, Boot Code Protection
Display interface supporting buffered and unbuffered color displays up to HVGA resolution
High-speed serial display interface for cost efficient clamshell mechanics
3 MPixel camera interface
HW accelerators for 2D graphics, colour code conversion, motion estimation
MP3, AAC, AAC+, enhanced AAC+ capable
Support for video telephony, streaming, recording and playback
Multimedia extension interface for support of high end video and graphic accelerators
2 x SDIO interfaces, 2 I2S, Fast IRDA
USB 2.0 on-the-go, full speed
NAND flash controller supporting burst mode and error detection
Support of DDR-SDRAM devices

調(diào)制解調(diào)器的主要特性:

3GPP Release 5 compliant dual mode protocol stack (EDGE/HSDPA)
HSDPA - category 8 (7.2Mbit/s)
Implementation of fractional chip rate equalizer
Configurable to lower categories/data rates
Option to switch off HSDPA to save power
WCDMA 384kbit/s class for uplink and downlink
EDGE multislot class 12
GPRS/GSM
FR, HR, EFR, AMR codecs
SAIC/DARP integrated
DTM class 11
64 voices polyphonic ringing
Echo cancellation/noise reduction
GTT/TTY

主要的優(yōu)勢:
Less than 1000 mm² for a dual mode HSDPA(triband) and EDGE (quadband) modem

solution
High integration level of key multimedia features allows minimum cost of system solutions for tomorrow’s mobile phones
High overall system performance with high speed ARM subsystem and DDR memory access
Proven leading-edge modem technology with WCDMA, HSDPA cat. 8 as well as third
generation E-GPRS evolution
Feature upgrade flexibility through optional companion/multimedia chips via standardized interface
Support of connectivity modules such as Bluetooth, WLAN, A-GPS, DVB-H, FM Radio, etc.



圖1.X-GOLDTM608方框圖