國際半導(dǎo)體設(shè)備與材料協(xié)會(huì)(SEMI)于6月20日公布的五月份訂單出貨比報(bào)告顯示，2013年5月份北美半導(dǎo)體設(shè)備制造商接獲訂單的3個(gè)月平均金額為13.2億美元，訂單出貨比為1.08。1.08意味著當(dāng)月新增訂單總金額與當(dāng)月設(shè)備出貨總金額的比值為108：100。

2013年5月北美半導(dǎo)體設(shè)備制造商接獲全球訂單的3個(gè)月平均金額為13.2億美元，較4月最終值（11.7億美元）增長12.5%，低于2012年5同期的訂單額，較2012年同期的16.1億美元縮減18.1%。

 North America-based manufacturers of semiconductor equipment posted $1.32 billion in orders worldwide in May 2013 (three-month average basis) and a book-to-bill ratio of 1.08, according to the May EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in May 2013 was $1.32 billion. The bookings figure is 12.5 percent higher than the final April 2013 level of $1.17 billion, and is 18.1 percent lower than the May 2012 order level of $1.61 billion.

The three-month average of worldwide billings in May 2013 was $1.22 billion. The billings figure is 12.6 percent higher than the final April 2013 level of $1.09 billion, and is 20.5 percent lower than the May 2012 billings level of $1.54 billion.

“The SEMI Book-to-bill continues to show steady improvement as the ratio remains at or above parity for the fifth consecutive month,” said Daniel P. Tracy, senior director of Industry Research and Statistics at SEMI.  “The spending outlook for the year is improving as foundries continue to invest in advanced technologies and NAND manufacturers plan to increase spending on equipment.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

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Source: SEMI, June 2013

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.