半導體封裝材料市場在2009年收縮，出貨量及材料消耗量在今年二季度開始恢復，并且有望延續(xù)到四季度。塑料封裝材料（包括熱介面材料）預計將達到158億美元，較2008年的172億美元下降8%。由于材料消耗量的增加，該市場有望在2010年達到176億美元，到2013年達到201億美元。對于封裝材料市場的關鍵部分來說，直到2011年，市場將穩(wěn)步增長。

Packaging Material Segment主要封裝材料

半導體封裝市場的增長領域包括：倒裝芯片、晶圓級封裝、BGA球柵列陣、應用引線框架的芯片級封裝(CSP)、堆疊芯片封裝以及系統(tǒng)級封裝/多芯片封裝。隨著應用需求的不斷增加，越來越多傳統(tǒng)的封裝技術將運用于實際產(chǎn)品中。

在不斷推進封裝技術的過程中，現(xiàn)有材料的改進以及新興材料的發(fā)展都是十分關鍵的。以下為部分觀察報告：

1.有機基板

對于有機襯底材料來說，倒裝芯片應用取得了卓越進步。倒裝PBGA的成長驅(qū)動主要來自于對電性能，芯片上電源分布以及日益受限的Pad設計的需求。波形系數(shù)及需求一直驅(qū)動著處理器及無線應用設備中線焊到倒裝芯片的轉(zhuǎn)換。未來幾年，隨著供應的增加以及不斷改善的材料利用率及生產(chǎn)良率，基板價格有望下降。

2.引線框架

目前在引線框架生產(chǎn)過程中，生產(chǎn)商專注于提升電鍍及表面處理能力，以滿足產(chǎn)品的濕度敏感性要求。由于銅的價格不斷上漲，供應商不斷評估新材料以降低成本。部分引線框架廠商采用中國本土企業(yè)生產(chǎn)的引線框架合金作為生產(chǎn)的原材料。

3.塑封料

設備商及封裝廠商強調(diào)了低K電介質(zhì)設備的兼容性、超細間距引線，銅鍵合絲對于塑封材料的發(fā)展也極為重要，需要利用塑封料來改善較薄以及堆疊封裝中的翹曲。改善塑封料對于傳統(tǒng)的傳遞型封裝技術中的細間距填充，包括過模壓填充應用來說，是必要的。

4.鍵合絲

金線供應商正積極發(fā)展合金線、控制金屬微觀結構屬性來滿足不同封裝設計及form factor中的可靠性需求。而關系到供應商及他們客戶的切身問題是不斷上漲的金價。因此，不斷向更小直徑轉(zhuǎn)移的金線成為了引人關注的焦點，近70%的出貨金線均是直徑小于25微米。銅金線的使用已越來越頻繁，已占總鍵合絲市場的5%以上。

目前對于新材料發(fā)展的趨勢和驅(qū)動力就是產(chǎn)業(yè)范圍內(nèi)降低半導體封裝的成本壓力。所有的封裝材料市場都面臨著發(fā)展低成本解決方案的壓力。供應鏈上的各個企業(yè)需要共同協(xié)作來推動新材料的發(fā)展及成本降低。

所有信息均來自最近SEMI與TechSearch International合作出版的市場調(diào)研“全球半導體封裝材料市場展望──2009-2010版”。報告深度采訪了全球超過140家半導體制造商、封裝及封裝材料供應商。

若需訂閱“全球半導體封裝材料市場展望──2009-2010版”，請聯(lián)系Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI ，email at dtracy@semi.org

電話：1.408.943.7987 傳真：1.408.943.7915。

Growing Packaging Materials Market under Pressure

Cost Reduction Pressures Impact the Market

By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI

While the semiconductor packaging materials market will contract in 2009, a recovery in unit shipments and materials consumption occurred in the second quarter of the year and looks to continue through the fourth quarter. As a result, plastic packaging materials (including thermal interface materials) will be an estimated $15.8 billion, down 8% from the $17.2 billion reported in 2008. This market is forecast to reach $17.6 billion in 2010 and grow to $20.1 billion by 2013 as material consumption is projected to increase. Steady unit growth is expected through 2011 for key segments of the packaging materials market.

Packaging Material Segment

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Going forward, semiconductor packaging growth areas include flip chip, wafer-level packaging (WLP), ball grid array (BGA), leadframe-based chipscale packaging (CSP), stacked die packages, and system-in-package (SiP)/multichip packages. More traditional packaging technologies will see demand continue to increase for some applications, though stagnant in others and, for some basic form factors, to continue to decline. Improvements in existing materials and the development of new materials are critical in advancing packaging technologies. Here are some observations for specific segments:

1. Organic Substrates

For the organic substrate materials, flip chip applications have grown dramatically. The drivers for flip chip PBGAs continue to be electrical performance, on-chip power distribution, and pad limited designs. Form factor and performance are driving the shift from wire bond to flip chip for processors and other devices used in wireless applications. Over the next several years, substrate prices are expected to decline as a result of increased supply and improved material utilization and yield.

2. Leadframes

On-going technological enhancements in leadframe manufacturing focus on plating and surface treatment technologies in an effort to achieve desired moisture sensitivity specifications for packages. Suppliers continue to report the evaluation of new materials to lower costs in light of rising copper prices. Part of this is assessing and using leadframe alloys supplied by China-based companies.

3. Mold Compounds

Input from device makers and packaging subcontractors highlight compatibility with low-k dielectric devices, fine and high-density pitch wire, as well as copper bonding wire as important areas for on-going materials development for mold compounds. Materials are needed to reduce warpage in thin and stacked packages. Improved mold compounds are required for thin gap filling for conventional transfer mold technology, including over-molded underfill applications.[!--empirenews.page--]

4. Bonding Wire

Wire suppliers continue to develop new wire alloys and control metal microstructures with properties to meet the various, yet demanding requirements in processing and packaging reliability for differing packaging designs and form factors. Of concern to suppliers and their customers is the rising price of gold metal. As a result, the migration to smaller diameter wire has been noticeable with almost 70% of the wire shipped less than 25 micron in diameter. Use of copper wire is increasing and it now represents over 5 percent of the total wire market.

Clearly entwined with the trends and drivers for new materials development are the industry-wide pressures to reduce the cost of electronics and semiconductor packages.

All segments of the packaging materials market are under pressure to develop lower cost solutions. Companies across the supply chain will need to collaborate to balance the needs of new materials development and cost reduction efforts.

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All of the information in this article was derived from a recently completed market research study, Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, produced by SEMI and TechSearch International. In developing this report, over 140 in-depth interviews were conducted with semiconductor manufacturers, packaging subcontractors and packaging materials suppliers throughout the world.

TO ORDER YOUR COPY of Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, please contact Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI via email at dtracy@semi.org, or telephone 1.408.943.7987 or facsimile 1.408.943.7915. You can also click here for sample, pricing, and ordering information.