根據(jù)SEMI World Fab Forecast的最新預(yù)測(cè)，晶圓廠(chǎng)建設(shè)支出自2008年來(lái)持續(xù)呈現(xiàn)季度負(fù)增長(zhǎng)，2009年預(yù)計(jì)同比減少56%。從全球來(lái)看，建設(shè)支出達(dá)到10年來(lái)最低點(diǎn)。然而，該報(bào)告的最新數(shù)據(jù)顯示，2009年下半年晶圓廠(chǎng)建設(shè)支出和設(shè)備支出將恢復(fù)增長(zhǎng)，并將持續(xù)至2010年。2010年，晶圓廠(chǎng)建設(shè)支出預(yù)計(jì)成倍增長(zhǎng)，設(shè)備支出也可能增長(zhǎng)多達(dá)90%。

實(shí)際上美國(guó)資本投入正在增長(zhǎng)，季度支出額正在朝10億美元邁進(jìn)，主要因?yàn)镮ntel宣布了投資計(jì)劃，準(zhǔn)備轉(zhuǎn)入32nm制程。

根據(jù)報(bào)告，2008年關(guān)閉19家晶圓廠(chǎng)，2009年將關(guān)閉35家，2010年預(yù)計(jì)關(guān)閉14家。2009年預(yù)計(jì)將新開(kāi)9家晶圓廠(chǎng)。從整體趨勢(shì)來(lái)看，新開(kāi)產(chǎn)能增長(zhǎng)自1995年就開(kāi)始放緩，多數(shù)新晶圓廠(chǎng)是300mm超級(jí)大型存儲(chǔ)器廠(chǎng)，這意味著晶圓廠(chǎng)的數(shù)量不需要更多，但需要更大。

2009年全球裝載產(chǎn)能預(yù)計(jì)減少3%，主要由于晶圓廠(chǎng)關(guān)閉，然而數(shù)據(jù)顯示2010年裝載產(chǎn)能可能增長(zhǎng)6%。存儲(chǔ)器和邏輯電路工廠(chǎng)預(yù)計(jì)2009年將受到最為嚴(yán)重的影響，預(yù)計(jì)裝載產(chǎn)能將分別減少5%-7%。

SEMI World Fab Forecast Reveals Signs of Increased Investment

2009 Spending on Fabs Construction Projects Expected to Decline by 56%

SAN JOSE, Calif. ? June 9, 2009 ? According to the latest update of the SEMI World Fab Forecast database, spending on fab construction projects has seen a consistent quarterly decline since 2008, and on a year-over-year basis is expected to fall by 56 percent in 2009. On a global scale, construction spending is at its lowest level in 10 years.?? However, the latest data from the report suggest an increase in investments for both fab construction projects and fab equipping in the second half of 2009, with the trend continuing into 2010.? In 2010, investments in fab construction projects are expected to almost double and spending on equipping fabs may increase by as much as 90 percent year-over-year from the significant declines expected in 2009, according to the report.

Investments are actually increasing in the Americas, with a total quarterly spending increasing to almost US$1 billion, mainly due to major investments announced by Intel, as the company moves forward on a planned upgrade to 32nm.

According to the report, 19 fab facilities closed in 2008, and about 35 facilities will close in 2009, though the number of closures should decline in 2010 as only 14 facilities are expected to close.? Nine fabs are expected to launch operations in 2009.? Overall the trend of new facilities commencing operations has slowed since 1995, due to the fact that most new fabs are 300mm Megafabs for memory production, meaning fewer but larger fabs are needed.

Worldwide installed capacity for 2009 is expected to decline by about three percent, mainly due to fab closures, however data from the World Fab Forecast show that installed capacity for 2010 could increase by about six percent.? Memory and logic fabs are expected to take the biggest hit in 2009, with a decline in installed capacity of five to seven percent each due to fab closures.

For more information about SEMI market statistics products including the SEMI World Fab Forecast, please visit www.semi.org/store.

The SEMI World Fab Forecast tracks money spent on Front End semiconductor facilities that are equipping, which includes volume fabs, R&Ds and Pilot fabs, fab construction projects, investments for capacity, and investments for technology and product upgrades.

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries.? SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives.? Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges.? SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.? For more information, visit www.semi.org.